Fraunhofer IZM

Fraunhofer IZM specializes in industry-oriented applied research. Fraunhofer IZM develops assembly and interconnection technology, also known as electronic packaging. Almost invisible and undervalued by many, microelectronic packaging is at the heart of every electronic application. Our technologies connect the individual components, protect components and devices from vibration and moisture, and reliably dissipate heat. Fraunhofer IZM thus ensures that electronic devices continue to function reliably in even the harshest conditions. Modern packaging technologies make developing smaller and smaller products possible. We process ICs thinner than a sheet of paper. The institute, founded in 1993, has a staff of nearly 400 and disposes of a lab area of more than 8,000 sqm. More than 80 percent of our turnover in 2019 was earned through contract research.

Processes, technologies as well as test and analysis methods for reliability are developed with a focus on the medium and long-term development of microelectronics. Consequently with more than 25 years of existence, the Fraunhofer IZM is one of the leading institutes in the field of microelectronics and microsystem packaging worldwide. The transfer of research results to the industry (small, medium and large enterprises) and the development of customspecific solutions for microelectronic packaging and system integration is one of the main tasks of the institute.

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Role in the Project

Fraunhofer IZM is providing its expertise for packaging of the targeted low power consumption microcontroller in form of an advanced packaging with focus on improved reliability in collaboration with Hyperstone. Its wafer backend processing platform will permit to package the electronic component using the technology of Fan-Out Wafer Level Packaging (FOWLP). Thermo-mechanical behaviour of the FOWLP package will be investigated in parallel using parametric simulation tools, allowing enhanced understanding of the packaging characteristics. The developments will be supported by means of available analytics at the institute, i.e. non-destructive analysis and destructive analysis and imaging techniques. The project will broaden the range of knowledge of the integration by FOWLP for the targeted final application.